Kester EnviroMarkTM 907 is a lead-free, air and nitrogenreflowableno-clean solder paste specifically designed for thethermalrequirements of lead free alloys, including the SAC305alloy.Thepaste flux system allows joint appearances that closelyresemblethat achieved with SnPb alloys. EM907 is capable ofstencilprinting downtimes up to 60 minutes with an effective firstprintdown to 20 mils without any kneading. EM907 also exhibitsexcellentcontinual printability for fine pitch (0.4mm/16 mils) andis ableto print at high speeds up to 6 in/s (150 mm/s). This solderpastealso exceeds the reliability standards requiredbyJ-STD-004.