Kester TSF-6592 is a No Clean Paste Flux designedasaLeadFreeSolution for an array of LeadFreeinterconnectapplicationssuchas flip chip attach, sphere orballattach,rework/repair ofCSPs,BGAs, SMDs, or any LeadFreesolderingapplication thatrequires avery tacky flux. 用于在空气或氮气环境下**峰温度达到270℃球及芯片覆置应用。对于OSP-Cu,ENIG及浸置表面处理免上具温度稳定性及坚固耐用的活化剂。